Nitto Boseki Co., Ltd. · Year ended March 2026

The glass cloth Nittobo supplies for AI circuit boards

Nittobo makes materials and products including glass fiber for electronic boards, insulation for homes and diagnostic reagents. Its electronic-materials business supplies glass yarn and woven glass cloth to customers such as copper-clad laminate manufacturers.

Fine glass yarn opens into woven cloth and connects with layered resin-and-copper boards, a semiconductor package and a server board.

From glass yarn to the inside of a board

Nittobo’s materials pass through laminate and circuit-board manufacturing before becoming part of electronic equipment.

  1. Nittobo

    Supply yarn and cloth

    Fine glass yarn unwinds from a spool into cloth with crossing warp and weft threads.

    Fine glass yarn is woven and treated to make cloth. Nittobo also sells the yarn itself.

  2. Laminate and board makers

    Combine cloth, resin and copper

    An exploded structure separates copper foil, woven glass cloth and resin. Crossing glass fibers become part of the resin layer.
    • Copper foil
    • Glass cloth
    • Resin

    Cloth is combined with resin. Inside the copper-containing board, it provides insulation and reinforcement.

  3. Manufacturers using the boards

    Boards beneath the chip

    An exploded electronic assembly shows a chip, a smaller package substrate and a larger motherboard beneath it. Two different board levels are visible.

    Chip → Package substrate → Motherboard

    Glass cloth is used in the package substrate beneath a chip and in the motherboard below it.

Simplified structure and layer count. Glass types are selected for their applications.

Source: Integrated Report 2026, PDF p.25 (printed p.24; Japanese)

Different glasses for signal loss and board warpage

Deciding which production steps will meet growing demand

DATA VIEW

Electronic-materials sales to external customers

Actual results for the years ended March 2025 and March 2026, in ¥ million. Excludes intersegment sales; a common scale starts at zero. Source: financial results, PDF pp.16–17.

Electronic-materials sales to external customers
Year ended March 2025¥40,911m
Year ended March 2026¥49,265m
CONCEPT MAP

Dividing the work of supplying more glass cloth

Policy described in September 2026. This does not state that weaving for every product will move outside the group.

Nittobo's glass composition and process technologyCapacity investment and outside collaboration
  1. Melt glass and spin yarnConcentrate on special compositions and extremely fine yarn
  2. Collaborate in weavingOutsource weaving work to Nan Ya Plastics
  3. Finish the clothStrengthen surface-treatment technology and capacity

Consolidated net income also includes an asset-sale gain

THE VIEW AFTER THE NUMBERS

What the numbers suggest

Nittobo supplies woven glass that insulates and reinforces electronic boards. Within that material family, NE/NER limits signal loss while T glass addresses thermal expansion and warpage.

Serving the growth in electronic materials takes more than designing a composition. It requires consistent high-volume production of fine yarn and thin cloth, and additional capacity at the necessary processing stages. Outside collaboration in weaving and investment in Nittobo’s own facilities are choices about how to provide that supply.

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This is not investment advice or a stock recommendation. We reorder company-published primary-source facts to make the shape of the business easier to see.

Primary sources used

FY March 2026 Consolidated Financial Results (Japanese)

Nitto Boseki Co., Ltd. · 2026-05-12

Pages used: p.1,10,17 / p.4,16-17

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Nittobo Group Integrated Report 2026 (Japanese)

Nitto Boseki Co., Ltd. · 2026-09-30

Pages used: p.19 / p.20,34 / p.25 / p.34-35

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