DISCO supplies semiconductor and electronic-component manufacturers with equipment for cutting, grinding and polishing materials, along with consumable tools used on that equipment. It helps customers turn circular wafers into smaller, thinner chips through processing advice, equipment, tools and maintenance.
Grinding reaches the grooves and separates the chips
Cross-sections show the main DBG steps applied to the customer’s wafer.
1
Groove the wafer while it is thick
A dicing saw and blade cut to the intended chip thickness. Material still connects the wafer below the grooves.
2
Protect the front and grind the back
Apply protective tape to the front and turn the wafer over. A grinder and wheel remove material from the back.
3
Reach the grooves to separate thin chips
As grinding reaches the grooves, the chips separate. Protective tape supports their front surfaces.
Schematic cross-sections, not to scale. Tool shapes and travel are simplified. The figure ends at thinning and separation; later frame mounting and protective-tape removal are omitted.
These roles are combined around the customer's material and intended finish. They are not four accounting revenue categories.
The customer's processing resultSeparate, thin or finish the material
Precision processing equipmentMoves the blade or wheel to carry out the process
Consumable processing toolsBlades and abrasive wheels act on the material
Application engineeringSelects and tests products and processing conditions
After-sales serviceSupports operation through maintenance and training
Sources: DISCO Business overview; Annual Securities Report, physical p.10 (Japanese).
Equipment installation and factory operation bring different sales
The following figures cover the consolidated year ended March 2026, April 1, 2025–March 31, 2026. DISCO calls this FY2025.
DATA VIEW
Equipment and consumables on the same revenue scale
Consolidated product revenue for the year ended March 2026, in ¥ billion. A common scale starts at zero. These are recognized sales, not shipment values.
Precision processing equipment¥273.957bn
Precision processing tools¥94.976bn
Other¥67.955bn
Source: Annual Securities Report, physical p.127. Source amounts are truncated below ¥1 million, so the product rows sum to ¥1 million less than the reported consolidated total. Equipment, tools and other are product categories.
Demand differs with the chips being processed
DBG is an example of how DISCO combines equipment and tools. DBG-specific revenue and its contribution to growth in this fiscal year are not disclosed.
THE VIEW AFTER THE NUMBERS
What the numbers suggest
DISCO’s work begins with selecting equipment and tools for a customer’s material and finding conditions that produce the required result. Grooving before backside grinding makes that combination visible.
In the year ended March 2026, consumable tools generated ¥94.976bn alongside equipment sales. Testing before purchase, processing that continues in a factory, and research into new materials and methods connect the different parts of the business.
Azbil combines sensors, valves and control systems to adjust airflow and when heating and cooling equipment operates. Alongside testing technology in its own building, it offers services that use customers’ operating data to propose improvements and assess the results. In the year ended March 2026, BA sales rose 5.1% despite lower new-building sales, and segment profit grew 18.6%. Control, renovation and service work continue after a building is completed.
